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Scrap Wafer Milling Machine

It is the machine used to grind the unused side edge parts of the wafer blocks cut in the wafer cutting machine during the operation of the production line and to re-mix the cream into the cream preparation.
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- It is the machine used to grind the unused side edge parts of the wafer blocks cut in the wafer cutting machine during the operation of the production line and to re-mix the cream into the cream preparation.
- The particle of the wafer are grinded properly by means of helix and steel blades inside the machine.
- It's compatible for grinding wafer, cookies and cake particle.

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